Diamond Dicing Blades

Resin bond diamond dicing blades are mainly used for semiconductor, optical glass, quartz glass, ceramics etc.

Product Application

In the application of semiconductor component(QFN, PQFN), the using of resin bond diamond dicing blades can avoid burrs, and improve efficiency and life.

For the application of optical glass, resin bond diamond dicing blades can avoid chips and improve yield.

In the application of quartz glass, resin bond diamond dicing blades can avoid chips improving the efficiency and finish of the products.

When dicing the ceramics, resin bond diamond dicing blade can avoid chips and cracks and improve the processing quality.

When processing other material, such as slotting and cutting of crystal, magnetic materials, carbide and some other metal materials difficult to cut, resin bond diamond dicing blades show excellent cutting quality.

Type of Resin Bond Diamond Dicing Blades

The models of diamond dicing blades are divided into 1A8/1 type without water slot and 1A8/2 type with water slot.